A leading global semiconductor foundry UMC was founded in 1980 as Taiwan’s first semiconductor company.
UMC – Foundry Technology – Taiwan
The high tech processes include 28nm poly-SiON and gate-last High-K/Metal Gate technology. Even Specialized technologies like Mixed signal/RFCMOS.
“Wafers are transported automatically in a Front Opening Universal Pod (FOUP) that has a capacity of 25 wafers. In addition, lot movement is executed using Automated Material Handling System (AMHS) for interbay moves..”
UMC’s Collaborative Advantage
“SoC silicon supply chain – Equipment, EDA tool, and IP vendors to work synergistically towards each customer’s …”
- System Architecture Knowledge
- IP and Design Methodology
- Test and Package Solutions
No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C.
The Dedicated IC Foundry of TSMC is a foundation for logic IC innovations.It provides a complete range of services, including design and mask making services.
TSMC – Semiconductor Foundry
TSMC currently operates three 12-inch GIGAFAB fabrication facilities.
“TSMC has the broadest range of technologies and services in the Dedicated IC Foundry segment of the semiconductor manufacturing industry. The IC Industry Foundation strategy embodies an integrated approach that bundles process technology options and services.”
TSMC-Online is the first foundry delivery system to enable secure online business transactions and information transfer for creating product design, tape outs, and wafer tracking.
Through Silicon Via (TSV) technology to integrate multiple chips into a single device.
Higher density interconnects (lightens RC loading) resulting in enhanced performance (maybe RF too ?) and reduced power consumption in a smaller size.
Taiwan Semiconductor Manufacturing Company Limited
No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan 300-78, R. O. C.
MOSIS Is An Multi-Project Wafer (MPW) Integrated Circuit (IC) Fabrication Service Provider.
MOSIS – Affordable Integrated Circuits Fabrication
“MOSIS is operated by the Information Sciences Institute at the University of Southern California (USC). MOSIS merges multiple IC designs submitted by both companies and universities onto multi-project wafers (MPW) to share the cost of fabrication among multiple users.”
MOSIS – Metal Oxide Semiconductor Implementation Service
MOSIS keeps the cost of fabricating prototype quantities low by aggregating multiple designs onto one mask set. This allows customers to share overhead costs associated with mask making, wafer fabrication, and assembly.
MOSIS Design Reference
A variety of design flows (digital, analog, mixed-signal) can be used with a number of different CAD tools, technology files, design kits, libraries and IP to create designs for processes accessed by MOSIS.
MOSIS Integrated Circuit Fabrication Service
USC Information Sciences Institute, 4676 Admiralty Way, 7th floor
Marina del Rey, CA 90292-6695, USA
They develop software tools which are of great interest to designers of PCB, Microwave/RF, MEMS, IC, chemically milled parts and optical components.
Numerical Innovations – CAD CAM for EE
“AutoGERB (world’s first exporting of Gerber data directly from AutoCAD) and CAMtastic! (a CAM viewer which morphed into the first PCB DFM tool of its kind). They were the first in the industry to do some “cutting-edge” marketing by offering their products to be downloaded directly from the Web with a full 45 day trial..”
EasyGerb 4 is perfect for AutoCAD users looking for the easiest & most powerful way to output gerber files from their AutoCAD drawings.
Numerical Innovations, LLC. Division of Caneberra Technologies Inc.
1888 Kalakaua Ave, Suite #C312, Honolulu, Hawaii 96815, USA