ISQED – Design and Design Automation

International Society for Quality Electronic Design is the pioneer and leading conference dealing with design for manufacturability and quality issues, front to back. It is now a non-profit international professional organization.

ISQED – Design and Design Automation

Targetted Audience – Researchers, Developers, and Users of EDA/TCAD Tools & Design Flows and Methodologies.

They cover Design Methods, Design Processes, Semiconductor technologies, nano-technologies,IC packaging, Test, design automation tools & methodologies..

.ISQED 2014 Theme: Security in a Connected World

ISQED - Design and Design Automation

ISQED
P.O.Box 607 Los Altos, CA 94023-0607 USA

NAND Flash Interface and ONFi

Open NAND Flash Interface – Made up of more than 80 companies that build, design-in, or enable NAND flash memory. This is used mainly as a storage component in many small devices. (boot, firmware/OS and Data).Standardizing the NAND Flash interface.

NAND Flash Interface and ONFi

ONFI’s parameter page provides the controller with all of the device’s relevant capabilities for quicker design, qualification, and testing.

ONFI’s industry-standard BGA package accommodates both asynchronous and source-synchronous interfaces.

NAND Flash Interface and ONFi

Higher Speeds At 400 MB/s, ONFI is the fastest NAND interface standard on the planet. These high speeds are made possible by the bidirectional source-synchronous DQS and scalable I/O interface.

ONFI 3 Announced in March of 2011

Promotes a high-speed NAND Flash interface supporting transfer rates up to 400 MB/s – requires fewer chip enable pins enabling more efficient PCB routing – designed for the future and supports the EZ-NAND interface.

Glew Engineering – Technology Expertise

Consulting Service for the semiconductor and microelectronic industry, FEA modeling, mechanical, electrical & materials engineering applications.

Glew Engineering – Technology Expertise

Experts in Electrical, Materials and Mechanical Engineering Consulting. Consulting and Support areas include Business Development, Solar & Flat Panel Technologies, Materials Science among many others.

FEA Applied to Semiconductor Equipment

CAD and finite element analysis (FEA)

FEA allows for comprehensive modeling of the chamber’s integrity during testing conditions. The FEA model serves as a virtual experiment that allows reduction in prototype cost and testing. An accurate model can reduce the costly repercussions of an incorrectly designed system.

(They may cover Mems and Mechatronics too. – delabs)

Glew Engineering Consulting Inc. 240 Pamela Drive, Mountain View, CA 94040 USA

Corning – Engineered Glass and Ceramics

American manufacturer of glass, ceramics and related materials, primarily for industrial and scientific applications.

Corning – Engineered Glass and Ceramics

The company was known until 1989 as Corning Glass Works, The Corning Museum of Glass

They Specialize in developing technologies and products in Displays, Telecommunications, Life Sciences, Specialty Materials and Environmental.

Corning - Engineered Glass and Ceramics

Corning Optical Fiber, part of Corning’s Telecommunications segment, invented the first low-loss optical fiber in 1970 and today remains the worldwide market leader, offering a full line of single-mode and multimode optical fibers for all network applications

Labware and Equipment from Corning – Scientific laboratory products. Consumable glass and plastic laboratory tools for life science research.

Gorilla Glass (wiki) is the registered trademark for an alkali-aluminosilicate sheet toughened glass manufactured by U.S. glassmaker Corning Inc. Engineered for a combination of thinness, lightness, and damage-resistance, it is used primarily as the cover glass for portable electronic devices including mobile phones, portable media players, laptop computer displays, and some television screens.

It is manufactured through immersion in a molten alkaline salt bath using ion exchange to produce compressive residual stress at the surface. This prevent cracks from propagating – for a crack to start, it will first have to overcome this compressive stress.