Product Development Fundamentals

A. Product Design Sections :

  1. Electronic Engineering – Circuit Design, PCB Design, EDA.
  2. Mechanical Engineering – CAD, Tool and Die Design, Enclosure
  3. Software Engineering Firmware – PC ware, CASE, emulators

B. Methods of Product Design :

  1. Design Automation. – Design and Simulation with Computer.
  2. Computer Aided Design – Design on Computer, Breadboard test.
  3. Conventional Design. – Paper design with Breadboard test

Circuit Design Service of delabs – Product and Circuit design. Consulting tech service.

C. Criteria of Product Design :

  1. Ergonomics – User friendly Interface of controls, display, etc..
  2. EMI / RFI Ext.- Immunity to external electrical disturbance.
  3. EMI / RFI Int. – Reduction of Internal electrical noise generation.
  4. Input Cost – Selecting Cost effective components and methods.
  5. Product Safety – Eliminating shock hazard, fire hazard or stress.
  6. Corrosion res.- Resistance to Chemical Fumes, brine, gases etc..
  7. Reliability – Long Life reliability engineering, MTBF, stability.
  8. Serviceability – Accessibility – Maintenance and repairs, Self test.
  9. Vibration – Enclosure / Components to be vibration resistant .
  10. Ease of Manufacture.- Manufacture ease and provision for test and Calibration..
  11. PC Interface – RS232, GPIB, etc. for PC Control and recording.
  12. Upgrade Ease – Options, Software change, Hardware upgrades.
  13. Quality – Design, Components, Production methods.
  14. Accuracy – Specifications of performance and its stability.
  15. Misuse-Abuse – Rugged design both electrically and mechanically.

D. Criteria of Circuit Design :

  1. Technologies – Time proven technology and Standard Parts.
  2. Reliability – Component Selection and Design Methods.
  3. Modular – Allow for incremental upgrades and Service.
  4. Safety Margins – Overrating for Voltage, threshold, speed, etc..
  5. Testability – Test Points, Isolating Jumpers, self test mode.
  6. Isolation – High voltage isolation, User safety, grounding.
  7. Thermal Limits – Dissipation Limit, Heatsinks, Shutdown, Size.
  8. Protections – Fuses, Current Limit, Zeners, Varistors, Alarm.
  9. Power economy – CMOS Designs, LCD Designs, SMPS, Portable.
  10. Electrical Parts – Connector selection, Relays, Switches, PCB.
  11. Precision – Accuracy, Resolution, Drift, Thermal stability.

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