Design Devices
Analog, Digital, Embedded and Power Electronics Design. Product and Circuit Design. Engineering and Manufacturing Services. System and Process Design.
Components and Materials
Design Gopher
About Design Devices
Design and Development Resource for Engineers and Companies. Components, Modules and Systems Sourcing Support.
This Application Covers Product and Circuit Design. Engineering and Manufacturing Services. System and Process Design. Companies with Products and Solutions for Above. It lists more than 700 Companies that are Manufacturing and Developing High-Tech Components for The Electronics Industry. They Include Test and Measurement and Industrial Automation.
If your Company/Brand does not show up in the Built in Search for this application. Please contact me with a Description of your Business. Contact delabs.
This Application Covers Product and Circuit Design. Engineering and Manufacturing Services. System and Process Design. Companies with Products and Solutions for Above. It lists more than 700 Companies that are Manufacturing and Developing High-Tech Components for The Electronics Industry. They Include Test and Measurement and Industrial Automation.
If your Company/Brand does not show up in the Built in Search for this application. Please contact me with a Description of your Business. Contact delabs.
Powered With
Powered by Drupal
ACE Production Technologies - Selective Soldering Systems
ACE Production Technologies - Selective Soldering Systems
"The system works in conjunction with pallets that hold the components in a known position through the process. Under program control a pallet of components moves to the central flux station where the component leads are immersed to a specific depth. The pallet then moves to the first solder pot (scavenging pot) where the component leads are dipped into the solder alloy and "scrubbed" to remove the existing coating.
The pallet returns to the flux station where the leads are once again fluxed then to the second solder pot for the final dip of fresh alloy creating a homogenous intermetalic coating. The pallet holder and pallets accept a wide variety of components such as axials, connectors, DIPs, QFPs and virtually all leaded devices making the system very versatile with minimal change over time."