“MOSIS is operated by the Information Sciences Institute at the University of Southern California (USC). MOSIS merges multiple IC designs submitted by both companies and universities onto multi-project wafers (MPW) to share the cost of fabrication among multiple users.”
MOSIS keeps the cost of fabricating prototype quantities low by aggregating multiple designs onto one mask set. This allows customers to share overhead costs associated with mask making, wafer fabrication, and assembly.
A variety of design flows (digital, analog, mixed-signal) can be used with a number of different CAD tools, technology files, design kits, libraries and IP to create designs for processes accessed by MOSIS.
MOSIS Integrated Circuit Fabrication Service
USC Information Sciences Institute, 4676 Admiralty Way, 7th floor
Marina del Rey, CA 90292-6695, USA
Products include integrated circuits (silicon chips) in Bipolar, Bi-CMOS and CMOS technologies, thick film hybrids (ceramic substrate) and surface mounted printed circuit board assemblies and modules. Hendon Semiconductors – Microelectronics Design
History -“The Hendon business site in Adelaide, South Australia has been a long established integrated circuit design and wafer fabrication facility in Australia, from its Philips semiconductor background up to 1997…”
A leading supplier of semi automatic and fully automatic inline printers, wafer bumping and wafer printing equipment. The equipment they manufacture are used in Surface Mount Technology (SMT) and Semiconductor Industries(SI).
Designs and Manufactures microelectronic and test and measurement products including ATE systems. The also Specialize in Radiation Hardened products and solutions for communications. They have solutions for design and manufacturing of high-reliability integrated circuits and packaging.
“Electronic Manufacturing Services (EMS) include Circuit Card Assembly, Custom Hybrid, MCM, Module, Radiation Effects Test and Support.”
The company is distributed over three continents. It has three 300mm fabs and five 200mm fabs. The major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States,
“The 28nm technologies are based on bulk silicon substrates, and are designed for a wide variety of applications from high performance such as graphics and wired networking to mobile computing and digital consumer to low power wireless mobile applications that require long battery lifetime.”
GLOBALFOUNDRIES Inc. 840 N McCarthy Blvd Milpitas, CA 95035, USA
The high tech processes include 28nm poly-SiON and gate-last High-K/Metal Gate technology. Even Specialized technologies like Mixed signal/RFCMOS.
“Wafers are transported automatically in a Front Opening Universal Pod (FOUP) that has a capacity of 25 wafers. In addition, lot movement is executed using Automated Material Handling System (AMHS) for interbay moves..”
TSMC currently operates three 12-inch GIGAFAB fabrication facilities.
“TSMC has the broadest range of technologies and services in the Dedicated IC Foundry segment of the semiconductor manufacturing industry. The IC Industry Foundation strategy embodies an integrated approach that bundles process technology options and services.”