MOSIS Is An Multi-Project Wafer (MPW) Integrated Circuit (IC) Fabrication Service Provider.
MOSIS – Affordable Integrated Circuits Fabrication
“MOSIS is operated by the Information Sciences Institute at the University of Southern California (USC). MOSIS merges multiple IC designs submitted by both companies and universities onto multi-project wafers (MPW) to share the cost of fabrication among multiple users.”
MOSIS – Metal Oxide Semiconductor Implementation Service
MOSIS keeps the cost of fabricating prototype quantities low by aggregating multiple designs onto one mask set. This allows customers to share overhead costs associated with mask making, wafer fabrication, and assembly.
MOSIS Design Reference
A variety of design flows (digital, analog, mixed-signal) can be used with a number of different CAD tools, technology files, design kits, libraries and IP to create designs for processes accessed by MOSIS.
MOSIS Integrated Circuit Fabrication Service
USC Information Sciences Institute, 4676 Admiralty Way, 7th floor
Marina del Rey, CA 90292-6695, USA
Products include integrated circuits (silicon chips) in Bipolar, Bi-CMOS and CMOS technologies, thick film hybrids (ceramic substrate) and surface mounted printed circuit board assemblies and modules.
Hendon Semiconductors – Microelectronics Design
History -“The Hendon business site in Adelaide, South Australia has been a long established integrated circuit design and wafer fabrication facility in Australia, from its Philips semiconductor background up to 1997…”
Thick Film Hybrid Technology
The advantage of ceramic hybrids over fiberglass printed circuit is their high reliability due to their inherent rugged construction with the following advantages:
Hendon Semiconductors Pty. Ltd
ABN: 17 080 879 616, 1 Butler Drive, Hendon, South Australia 5014, Australia.
A leading supplier of semi automatic and fully automatic inline printers, wafer bumping and wafer printing equipment. The equipment they manufacture are used in Surface Mount Technology (SMT) and Semiconductor Industries(SI).
Milara Inc – Solutions for Semiconductor Industries
They also provide mechanical and electrical engineering design services and Manufacturing Support.
“The MiniTouch semi-automatic stencil/screen printer offers advanced technological features and combines them with unprecedented ease of operation.”
MiniTouch MT2020 Semi Automatic Stencil Printer
- High precision/low volume prototyping
- Vibration squeegee technology equipped
- Dual squeegee Pressure Control option.
- Print Area 12 x 14 inches.
- Closed Loop Servo Torque Drive Systems
4 Marc Road Medway, MA 02053 USA
Designs and Manufactures microelectronic and test and measurement products including ATE systems. The also Specialize in Radiation Hardened products and solutions for communications. They have solutions for design and manufacturing of high-reliability integrated circuits and packaging.
“Electronic Manufacturing Services (EMS) include Circuit Card Assembly, Custom Hybrid, MCM, Module, Radiation Effects Test and Support.”
Aeroflex – Microelectronic and Instrumentation
CPM is an integrated microwave frequency counter, true power meter and digital voltmeter, which addresses the fundamental measurements made on digital microwave radios.
Counter Power Meter 20 & 46 – Aeroflex
10 MHz to 20 GHz and 10 MHz to 46 GHz versions available. Frequency counter incorporates a DTCXO removing warm-up period.
RF Microwave and T&M; technologies inherited from Marconi Instruments.
Marconi Instruments (GEC) >> IFR Systems Inc. (Instrument Flight Research Corporation) 1998 >> Aeroflex 2002.
35 South Service Road P.O. Box 6022 Plainview , NY 11803-0622, USA.
The company is distributed over three continents. It has three 300mm fabs and five 200mm fabs. The major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States,
GLOBALFOUNDRIES – Semiconductor Manufacturing Fab
GlobalFoundries was created by the divestiture of the manufacturing fab of AMD and later it enhanced its global presence after the merger with Chartered Semiconductor.
“Manufacturing centers in Germany, the United States and Singapore deliver advanced technologies to market in high volume…”
Assured long term supply and innovation of 200mm technologies with scalable plug-in modules such as analog/RF, High Voltage and embedded memories.
28nm Systems-on-Chip (SoCs) design platform
“The 28nm technologies are based on bulk silicon substrates, and are designed for a wide variety of applications from high performance such as graphics and wired networking to mobile computing and digital consumer to low power wireless mobile applications that require long battery lifetime.”
840 N McCarthy Blvd Milpitas, CA 95035, USA
A leading global semiconductor foundry UMC was founded in 1980 as Taiwan’s first semiconductor company.
UMC – Foundry Technology – Taiwan
The high tech processes include 28nm poly-SiON and gate-last High-K/Metal Gate technology. Even Specialized technologies like Mixed signal/RFCMOS.
“Wafers are transported automatically in a Front Opening Universal Pod (FOUP) that has a capacity of 25 wafers. In addition, lot movement is executed using Automated Material Handling System (AMHS) for interbay moves..”
UMC’s Collaborative Advantage
“SoC silicon supply chain – Equipment, EDA tool, and IP vendors to work synergistically towards each customer’s …”
- System Architecture Knowledge
- IP and Design Methodology
- Test and Package Solutions
No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C.
The Dedicated IC Foundry of TSMC is a foundation for logic IC innovations.It provides a complete range of services, including design and mask making services.
TSMC – Semiconductor Foundry
TSMC currently operates three 12-inch GIGAFAB fabrication facilities.
“TSMC has the broadest range of technologies and services in the Dedicated IC Foundry segment of the semiconductor manufacturing industry. The IC Industry Foundation strategy embodies an integrated approach that bundles process technology options and services.”
TSMC-Online is the first foundry delivery system to enable secure online business transactions and information transfer for creating product design, tape outs, and wafer tracking.
Through Silicon Via (TSV) technology to integrate multiple chips into a single device.
Higher density interconnects (lightens RC loading) resulting in enhanced performance (maybe RF too ?) and reduced power consumption in a smaller size.
Taiwan Semiconductor Manufacturing Company Limited
No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan 300-78, R. O. C.