Foundry-Wafer (Page 2)

A technology innovator in packaging and test solutions. The pakaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions.

They offer test services for many devices and designs that are used in Mordern day Electronic Gadgets that have application specific integrated circuits, memory devicea, and mixed signal and RF sections.

Amkor Technology – Semiconductor Services

Amkor also offers IC and Semiconductor Test Services. The also provide IC Package Design Services and complete turnkey solutions.

Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates.

Flip Chip BGA - Amkor Technology

This IC packaging technology is applicable for high pincount and / or high performance ASICs.

The variety of fcBGA package options allows package selection to be tailored to the specific thermal needs of the end product.

Flip Chip BGA – fcBGA

Amkor Technology
1900 South Price Road, Chandler AZ USA

“A global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panels, solar photovoltaic cells, flexible electronics and energy efficient glass.”

Applied Materials – Nanomanufacturing

Applied Materials’ IP portfolio includes more than 8,000 patents worldwide and technologies. “They make the machines that make the chips”.

Virtual Tour of Applied Materials Clean Room

A Virtual Tour of Applied Materials’ Clean Room

” Our machines harness plasma physics, chemistry and lots of computing power in order to fabricate nanoscale structures in the trillions, exactly the same, time after time after time. Many of our systems are developed at the Maydan Technology Center, located on our campus in Sunnyvale, California….”

Applied Materials
3050, Bowers Avenue, Santa Clara, CA 95054, USA