Foundry-Wafer (Page 2)

The company is distributed over three continents. It has three 300mm fabs and five 200mm fabs. The major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States,

GLOBALFOUNDRIES – Semiconductor Manufacturing Fab

GlobalFoundries was created by the divestiture of the manufacturing fab of AMD and later it enhanced its global presence after the merger with Chartered Semiconductor.

“Manufacturing centers in Germany, the United States and Singapore deliver advanced technologies to market in high volume…”

Assured long term supply and innovation of 200mm technologies with scalable plug-in modules such as analog/RF, High Voltage and embedded memories.

28nm Systems-on-Chip (SoCs) design platform

“The 28nm technologies are based on bulk silicon substrates, and are designed for a wide variety of applications from high performance such as graphics and wired networking to mobile computing and digital consumer to low power wireless mobile applications that require long battery lifetime.”

GLOBALFOUNDRIES Inc.
840 N McCarthy Blvd Milpitas, CA 95035, USA

A leading global semiconductor foundry UMC was founded in 1980 as Taiwan’s first semiconductor company.

UMC – Foundry Technology – Taiwan

The high tech processes include 28nm poly-SiON and gate-last High-K/Metal Gate technology. Even Specialized technologies like Mixed signal/RFCMOS.

 UMC - Foundry Technology - Taiwan

“Wafers are transported automatically in a Front Opening Universal Pod (FOUP) that has a capacity of 25 wafers. In addition, lot movement is executed using Automated Material Handling System (AMHS) for interbay moves..”

Advanced Automation

UMC’s Collaborative Advantage

“SoC silicon supply chain – Equipment, EDA tool, and IP vendors to work synergistically towards each customer’s …”

  • System Architecture Knowledge
  • IP and Design Methodology
  • Test and Package Solutions

UMC
No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C.

The Dedicated IC Foundry of TSMC is a foundation for logic IC innovations.It provides a complete range of services, including design and mask making services.

TSMC – Semiconductor Foundry

TSMC currently operates three 12-inch GIGAFAB fabrication facilities.
Chip-On-Wafer-On-Substrate)

“TSMC has the broadest range of technologies and services in the Dedicated IC Foundry segment of the semiconductor manufacturing industry. The IC Industry Foundation strategy embodies an integrated approach that bundles process technology options and services.”

TSMC’s eFoundry

TSMC-Online is the first foundry delivery system to enable secure online business transactions and information transfer for creating product design, tape outs, and wafer tracking.

Chip-On-Wafer-On-Substrate

Through Silicon Via (TSV) technology to integrate multiple chips into a single device.

Higher density interconnects (lightens RC loading) resulting in enhanced performance (maybe RF too ?) and reduced power consumption in a smaller size.

Taiwan Semiconductor Manufacturing Company Limited
No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan 300-78, R. O. C.

A technology innovator in packaging and test solutions. The pakaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions.

They offer test services for many devices and designs that are used in Mordern day Electronic Gadgets that have application specific integrated circuits, memory devicea, and mixed signal and RF sections.

Amkor Technology – Semiconductor Services

Amkor also offers IC and Semiconductor Test Services. The also provide IC Package Design Services and complete turnkey solutions.

Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates.

Flip Chip BGA - Amkor Technology

This IC packaging technology is applicable for high pincount and / or high performance ASICs.

The variety of fcBGA package options allows package selection to be tailored to the specific thermal needs of the end product.

Flip Chip BGA – fcBGA

Amkor Technology
1900 South Price Road, Chandler AZ USA